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CVE-2019-19196

nvd nist
Published: Feb 12, 2020Modified: Jun 17, 2026

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6.5
Vector
CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Exploitability: 2.8 / Impact: 3.6
Source: NVD

Description

The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.

Affected (5)

5 products
Tlsr8258 Ble Sdk
Tlsr8269 Ble Sdk
Tlsr8253 Ble Sdk
Tlsr8251 Ble Sdk
Tlsr8232 Ble Sdk
Configuration A
1 vulnerable · 1 platform
Vulnerable SoftwareAffected Versions
Up to 3.4.0
Running on/withPlatform Versions
Telink Semi
Tlsr8258
All versions
Configuration B
1 vulnerable · 1 platform
Vulnerable SoftwareAffected Versions
Up to 3.3
Running on/withPlatform Versions
Telink Semi
Tlsr8269
All versions
Configuration C
1 vulnerable · 1 platform
Vulnerable SoftwareAffected Versions
Up to 3.4.0
Running on/withPlatform Versions
Telink Semi
Tlsr8253
All versions
Configuration D
1 vulnerable · 1 platform
Vulnerable SoftwareAffected Versions
Up to 3.4.0
Running on/withPlatform Versions
Telink Semi
Tlsr8251
All versions
Configuration E
1 vulnerable · 1 platform
Vulnerable SoftwareAffected Versions
Up to 1.3.0
Running on/withPlatform Versions
Telink Semi
Tlsr8232
All versions

References (4)

Source: cve@mitre.org
Vendor Advisory
Source: cve@mitre.org
ExploitThird Party Advisory
Source: af854a3a-2127-422b-91ae-364da2661108
Vendor Advisory
Source: af854a3a-2127-422b-91ae-364da2661108
ExploitThird Party Advisory

Timeline

No history available yet.