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CVE-2016-2063

nvd nist
Published: Aug 7, 2016Modified: May 6, 2026

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7.8
Vector
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Exploitability: 1.8 / Impact: 5.9
Source: NVD

Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Affected (1)

Products: Linux: Linux Kernel
1 product
Linux Kernel
Configuration A
1 vulnerable
Vulnerable SoftwareAffected Versions
From 3.0 to 3.19.8

References (6)

Source: cve@mitre.org
Third Party AdvisoryVDB Entry
Source: af854a3a-2127-422b-91ae-364da2661108
Third Party AdvisoryVDB Entry
Source: af854a3a-2127-422b-91ae-364da2661108
Mailing ListPatchThird Party Advisory

Timeline

No history available yet.